Multi-wavelength LED construction &amp; manufacturing proces

ABSTRACT

A multi-wavelength LED construction and its manufacturing process having respectively coated on the base layer and the position above the peripheral of the light emitting chip a fluorescent material of a specific wavelength to be excited to provide higher light emitting efficiency and expected light color without mutual interference when the chip is conducted so to facilitate quality control of the multi-wavelength LED.

BACKGROUND OF THE INVENTION

(a) Field of the Invention

The present invention is related to an art of presenting LED lightemitting efficiency and light color, and more particularly, to amulti-wavelength LED construction and its manufacturing process thatproduce highly light emitting efficiency and accurate gloss.

(b) Description of the Prior Art

As illustrated in FIG. 1 for a schematic view of a basic construction ofa multi-wavelength LED of the prior art, a chip mounting gel 40 is usedto place a light-emitting chip 10 in a bowl shaped carrier 20; a goldenplated wire 30 constitutes the connection between the blue lightemitting chip 10 and two electrodes 21; and a fluorescent gel 50containing fluorescent powders is applied to cover up the light-emittingchip 10. When the light-emitting chip 10 is conducted, the fluorescentpowders in the fluorescent gel 50 are excited by the light source fromthe light-emitting chip 10 to emit the light in an expected color.

Generally, a blue chip is used in the multi-wavelength LED to exciteyellow fluorescent powders 51 mixed in the fluorescent gel 50 to producepseudo-white light that looks light white light. However, the prior artrelies upon only fluorescent powders in a straight color as thecomplementary light excited by the light-emitting chip, the resultantpseudo-white gloss is poor and blamed for yellow halo phenomenon. Tocorrect, two types of fluorescent powders in different colors are mixedin the fluorescent gel for the multi-wavelength LED. Usually, a bluechip is used to excite red fluorescent powders 52 and green fluorescent53 mixed in the fluorescent gel 50 for the red light and the green lightto incorporated with the blue light of the light-emitting chip 10 forobtaining RGB mixing results to produce the light color that is withhigher color development properties and closer to the white light.However, the amount and proportion of the fluorescent powders indifferent colors prevent easy control for effective control of thequality of the finished product; and interference exists due to thatdifferent colors of fluorescent powders are excited at the same positionat the same time by the light source from the light-emitting chip. Thatis, the energy for the fluorescent powder of shorter wavelength will beabsorbed by that of longer wavelength to prevent estimate of theirconsumption ratio, and thus to fail the expected color deflection forpresenting the accurate expected light color. Furthermore, thefluorescent powder of shorter wavelength emits light of slightly longerwavelength which in turn excites the fluorescent powder to emit light ofeven longer wavelength thus to compromise the light emitting efficiencyto produce light at lower luminance.

SUMMARY OF THE INVENTION

The primary purpose of the present invention is to provide aconstruction of a multi-wavelength LED and its manufacturing process toprovide higher light emitting efficiency and expected light colorwithout mutual interference when the chip is conducted so to facilitatequality control of the multi-wavelength LED. To achieve the purpose, thepresent invention has respectively coated on the base layer and theposition above the peripheral of the light emitting chip a fluorescentmaterial of a specific wavelength to be excited allowing easy control ofthe amount and ratio of the fluorescent powders at different positions.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view showing a construction of a multi-wavelengthLED of the prior art.

FIG. 2 is a schematic view showing a construction of a multi-wavelengthLED of another prior art.

FIG. 3 is a schematic view showing a construction of a multi-wavelengthLED of a first preferred embodiment of the present invention.

FIG. 4 is a schematic view showing a construction of a multi-wavelengthLED of a second preferred embodiment of the present invention.

FIG. 5 is a schematic view showing a construction of a multi-wavelengthLED of a third preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 3, a first preferred embodiment of the presentinvention, a construction of a multi-wavelength LED has a chip mountinggel 40 to place a light-emitting chip 10 in a carrier 20; a goldenplated wire 30 constitutes the connection between the blue lightemitting chip 10 and two electrodes 21; and a fluorescent gel 50containing fluorescent powders is applied to cover up the light-emittingchip 10. When the light-emitting chip 10 is conducted, the fluorescentpowders in the fluorescent gel 50 are excited by the light source fromthe light-emitting chip 10 to emit the light in an expected color.

Wherein, the base layer and the peripheral of the light-emitting chip 10are respectively coated with one or a plurality of fluorescent materialof a given wavelength. When the light-emitting chip is conducted, thefluorescent materials are respectively excited to emit the light withexpected color without mutual interference. The process not onlyachieves the higher light emitting efficiency and correct color of lightemitted, but also allows easy control of the amount and proportion ofthe fluorescent materials at different positions to facilitate thequality control of the multi-wavelength LED and significantly increaseits production capacity.

FIGS. 3, 4 and 5 show three constructional types of the presentinvention. As illustrated in FIG. 3, a first preferred embodiment of thepresent invention has at the base layer of the light-emitting chip 10(the position of the chip mounting gel 40 as illustrated) is covered upwith a first fluorescent material 61 of comparatively longer wavelength,and the position above the peripheral of the light-emitting chip 10 (theposition of the fluorescent gel 50 as illustrated) is covered up with asecond type of the fluorescent material 62 of comparatively shorterwavelength. In practice, the light-emitting chip 10 relates to a bluechip and its base layer is covered up with red fluorescent materialwhile the position above the peripheral of the light-emitting chi 10 iscovered up with green fluorescent material to constitute alight-emitting diode of white light. The manufacturing process of thefirst preferred embodiment has the first fluorescent material ofcomparatively longer wavelength mixed with the gel to become the chipmounting gel. The fluorescent get is then coated on the carrier of thelight-emitting chip. The light-emitting chip is secured in the chipmounting gel and baked in position. The golden plated wire connects thelight-emitting chip and the electrodes. The second type of fluorescentmaterial of the comparatively shorter wavelength is also mixed with thegel to become a fluorescent gel. The gel is poured into the positionabove the peripheral of the light-emitting chip and baked in the oven.

As illustrated in FIG. 4, a second preferred embodiment of the presentinvention has the base layer of the light-emitting chip 10 (the positionof the chip mounting gel 40 as illustrated) covered with the first typeof fluorescent material 61 of a comparatively longer wavelength, and theposition above the peripheral of the. light-emitting chip 10 (theposition of the fluorescent gel 50 as illustrated) is covered with asecond and a third types of fluorescent materials 62, 63 each of acomparatively shorter wavelength. Wherein, the wavelength of the thirdtype of fluorescent material 63 is shorter than that of the first typeand longer than that of the second type of fluorescent materials 61,62.In practice, the light-emitting chip 10 relates to a blue chip. The baselayer of the light-emitting chip is covered with red fluorescentmaterial, and the position above the peripheral of the light-emittingchip is covered with green and yellow fluorescent materials toconstitute a white light-emitting diode. In the manufacturing process ofthe second preferred embodiment of the present invention, the first typeof the fluorescent material of comparatively longer wavelength is mixedwith the gel to become the chip mounting gel to be coated in the carrierof the light-emitting chip. The golden plated wire connects thelight-emitting chip and the electrodes. The second and the third typesof fluorescent materials each of the comparatively shorter wavelengthare also mixed with the gel to become a fluorescent gel. The gel ispoured into the position above the peripheral of the light-emitting chipand baked in the oven.

A third preferred embodiment of the present invention as illustrated inFIG. 5 has the base layer of the light-emitting chip 10 (the position ofthe chip mounting gel 40 as illustrated) covered with the first and thesecond types of fluorescent material 61, 62 each of a comparativelylonger wavelength, and the position above the peripheral of thelight-emitting chip 10 (the position of the fluorescent gel 50 asillustrated) is covered with a third type of fluorescent material 63 ofcomparatively shorter wavelength. Wherein, the wavelength of the thirdtype of fluorescent material 63 is shorter than that of the first type61 and longer than that of the second type of fluorescent material 62.In practice, the light-emitting chip 10 relates to a blue chip. The baselayer of the light-emitting chip is covered with red and yellowfluorescent materials, and the position above the peripheral of thelight-emitting chip is covered with green fluorescent material toconstitute a white light-emitting diode. In the manufacturing process ofthe third preferred embodiment of the present invention, the first andthe second types of the fluorescent materials each of comparativelylonger wavelength are mixed with the gel to become the chip mounting gelto be coated in the carrier of the light-emitting chip. The goldenplated wire connects the light-emitting chip and the electrodes. Thethird type of fluorescent material of the comparatively shorterwavelength is also mixed with the gel to become a fluorescent gel. Thegel is poured into the position above the peripheral of thelight-emitting chip and baked in the oven.

Alternatively, the first and the second fluorescent materials each oflonger wavelength are respectively mixed with the gel to produceseparate gel cakes. Both gel cakes are then respectively baked in theoven with the chip to produce separate semi-products. Both semi-productsare then placed in the carrier of the light-emitting chip and baked insequence. The golden plated wire connects the light-emitting chip andthe electrodes. The third type of fluorescent material of thecomparatively shorter wavelength is also mixed with the gel to become afluorescent gel. The gel is poured into the position above theperipheral of the light-emitting chip and finally baked in the oven.

The prevent invention provides an improved construction of amulti-wavelength LED and its manufacturing process, and this applicationis duly filed accordingly. However, it is to be noted that that thepreferred embodiments disclosed in the specification and theaccompanying drawings are not limiting the present invention; and thatany construction, installation, or characteristics that is same orsimilar to that of the present invention should fall within the scope ofthe purposes and claims of the present invention.

1-2. (canceled)
 3. A manufacturing process of the multi-wavelength LEDincludes the following steps: a. The first type of fluorescent materialof comparatively longer wavelength is mixed with a gel to become a chipmounting gel to be coated in a carrier of the light-emitting chip; b.The light-emitting chip is fixed in the chip mounting get and baked inpositions; c. The light-emitting chip and multiple electrodes arejoined; d. The second type of fluorescent material of comparativelyshorter wavelength is mixed with the gel to become a fluorescent gel tobe poured into the position above the peripheral of the light-emittingchip; and e. Finally, the fluorescent gel is baked in the oven. 4-6.(canceled)
 7. A manufacturing process of the multi-wavelength LEDincludes the following steps: a. The first type of fluorescent materialof comparatively longer wavelength is mixed with a gel to become a chipmounting gel to be coated in a carrier of the light-emitting chip; b.The light-emitting chip is fixed in the chip mounting gel and baked inposition; c. The light-emitting chip and multiple electrodes are joined;d. The second and the third type of fluorescent materials each ofcomparatively shorter wavelength are mixed with the gel to become afluorescent gel to be poured into the position above the peripheral ofthe light-emitting chip; and e. Finally, the fluorescent gel is baked inthe oven. 8-10. (canceled)
 11. A manufacturing process of themulti-wavelength LED includes the following steps: a. The first and thesecond types of fluorescent materials each of comparatively longerwavelength are respectively mixed with a gel to produce separate gelcakes; b. Both gel cakes are placed into the carrier of thelight-emitting chip in sequence, followed with the placement of thelight-emitting chip to be baked in position; c. The light-emitting chipand multiple electrodes are joined; d. The third type of fluorescentmaterial of comparatively shorter wavelength is mixed with the gel tobecome a fluorescent gel to be poured into the position above theperipheral of the light-emitting chip; and e. Finally, the fluorescentgel is baked in position.
 12. A manufacturing process of themulti-wavelength LED includes the following steps: a. The first and thesecond types of fluorescent materials each of comparatively longerwavelength are respectively mixed with a gel to produce separate gelcakes; b. Both gel cakes respectively made of the first and the secondtypes of fluorescent materials are baked into position with the chip tobecome a semi-product; c. The semi-product is placed into the carrier ofthe light-emitting chip and baked in position; d. The light-emittingchip and multiple electrodes are joined; e. The third type offluorescent material of comparatively shorter wavelength is mixed withthe gel to become a fluorescent gel to be poured into the position abovethe peripheral of the light-emitting chip; and f. Finally, thefluorescent gel is baked in the oven.